IPC Standarder för komponenter och ingående material
Komponenter
IPC-J-STD-033C
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface MountDevices
Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. These procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC. 18 pages. Released February 2012.
Pris: 496 kr (bok), 536 kr (CD), 744 kr (Bok + CD).
IPC-J-STD-020D
IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface MountDevices
Revision D.1 is a maintenance release to correct some editorial concerns identified by the developing committee.
Updated with extended support for components used for lead free assembly! This standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress. It is used to determine which classification level should be used for initial reliability qualification. These devices can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during solder reflow attachment. Developed by IPC and JEDEC. 14 pages. Released March 2008.
Pris: 416 kr (bok), 456 kr (CD), 640 kr (Bok + CD).
IPC-
J-STD-075
Classification of Non-IC Electronic Components for Assembly Processes
J-STD-075 picks up where J-STD-020 left off by providing test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing. The classifications represent maximum process sensitivity levels and do not establish rework conditions or recommended processes for an assembler. It outlines a process to classify and label non-semiconductor electronic component’s Process Sensitivity Level (PSL) and Moisture Sensitivity Level (MSL) consistent with the semiconductor industry’s classification levels (J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Devices and J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). This standard supersedes IPC-9503. Developed by ECA, IPC and JEDEC. 12 pages. Released August 2008.
Pris: 416 kr (bok), 456 kr (CD), 640 kr (Bok + CD).
Material för kretskort
IPC-J-STD-004B
Requirements for Soldering Fluxes
This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. This standard may be used for quality control and procurement purposes. The purpose of this standard is to classify and characterize tin/lead and lead-free soldering flux materials for use in electronic metallurgical interconnections for printed circuit board assembly. Soldering flux materials include the following: liquid flux, paste flux, solder paste, solder cream, and flux-coated and flux-cored solder wires and preforms. It is not the intent of this standard to exclude any acceptable flux or soldering material; however, these materials must produce the desired electrical and metallurgical interconnection.
Released December 2008.
Pris: 576 kr (bok), 616 kr (CD), 832 kr (Bok + CD).
IPC-J-STD-005A
Requirements for Soldering Pastes
Lists requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment (not included with purchase of this standard). Released February 2012.
Pris: 496 kr (bok), 536 kr (CD), 744 kr (Bok + CD).
IPC-HDBK-005
Guide to Solder Paste Assessment
This handbook is a companion to the solder paste standard J-STD-005 and should be considered to be a guide to help assess the applicability of a solder paste for its use in surface mount technology (SMT) processes. This document also suggests some test
methods that can help with designing and testing solder pastes. It is intended for use by both vendors and users of solder paste.This document has been written as a guide to assess the applicability of a solder paste for a specific process, given the tremendous number of permutations of different materials, atmospheres and process variables currently available. 50 pages. Released January 2006.
Pris: 576 kr (bok), 616 kr (CD), 832 kr (Bok + CD).
IPC-J-STD-006B
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for ''special'' electronic grade solders. This is a quality control standard and is not intended to relate directly to the material's performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32.
This standard is one of a set of three joint industry standards that prescribe the requirements and test methods for soldering materials for use in the electronics industry: IPC/EIA J-STD-004, Requirements for Soldering Fluxes; IPC/EIA J-STD-005, Requirements for Soldering Pastes; IPC J-STD-006, Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications. 27 pages. Released January 2006.
Pris: 416 kr (bok), 456 kr (CD), 640 kr (Bok + CD).
IPC-SM-817
General Requirements for Dielectric Surface Mounting Adhesives
Covers requirements for dielectric adhesives. Includes test methods to ensure components adhere to the board and survive soldering processes. 22 pages. Released November 1989. Included in the IPC-C-103 and IPC-C-1000 Collections.
Pris: 416 kr (bok), 456 kr (CD)
IPC-CC-830B
Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
This is the industry standard for qualification and quality conformance of conformal coating. Its intent is to show how to obtain maximum information with minimum test redundancy. Includes requirements and evaluations of material properties using standardized test vehicles. Amendment 1 updates include new qualification, retention and conformance inspection requirements for FTIR, MIR and hydrolytic stability. 18 pages. Released October 2008.
Pris: 416 kr (bok), 456 kr (CD), 640 kr (Bok + CD).
IPC-HDBK-830
Guidelines for Design, Selection and Application of Conformal Coatings
This handbook is a compilation of the conformal coating industry's practical experience, and will assist the designers and users of conformal coatings in making informed choices. Users will better understand the properties of the various conformal coatings, the results to be achieved by its application and how to verify that these goals have been met. Use this document as a supplement in conjunction with the industry standard for qualification and quality conformance of conformal coating, IPC-CC-830B. 88 pages. Released October 2002.
Pris: 744 kr (bok).
IPC-7525B
Stencil Design Guideline
This document provides guidelines for the design and fabrication of stencils for solder paste and surface-mount adhesive. Stencil design for various surface-mount technology, as well as mixed technology with through-hole or flip chip components is discussed.
This includes differences for tin lead and lead free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included. 28 pages. Released October 2011.
Pris: 496 kr (bok), 536 kr (CD), 744 kr (Bok + CD).