IPC Acceptanskrav för mönsterkort
IPC-A-600H
Acceptability of Printed Boards
The definitive illustrated guide to printed circuit board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With over 90 new or revised photographs and illustrations, revision H provides new coverage on topics such as copper wrap plating, copper cap plating of filled holes, and hole wall/barrel separation along with updated and expanded coverage for measling of printed boards, delamination and haloing, laminate voids/cracks, etchback, blind and buried via fill, and flexible circuits. The document sychronizes to the acceptability requirements expressed in IPC-6012C and IPC-6013B. 157 pages. Released April 2010.
Pris: 800 kr (bok), 840 kr (CD), 1200 kr (bok + CD).
Följande dokument finns på svenska.
IPC-A-600H-SE ”Acceptanskrav för mönsterkort” omfattar konventionella mönsterkort i FR4-material, flex, flex-rigid, metallbaskort och andra speciella mönsterkort såsom ytplana kort och mönsterkort med stansade hål. Nya och utökade kapitel har tillkommit, där bland annat överpläterade vior och fyllning av blinda och dolda vior är aktuella teknikområden för t ex via i pad. Flex-avsnittet har också utökats med krav för böjmärken i flexmaterialet.
Standarden är på 157 sidor och består av ett stort antal exempelbilder och figurer i färg, som med kortfattad text beskriver olika typer av defekter och vad som är acceptabelt respektive underkänt för respektive klass. Denna nya revision H har ett utökat antal färgbilder och grafik för att förtydliga kraven ytterligare. De flesta typer av avvikelser hos enkelsidiga, dubbelsidiga och flerlagerkort behandlas i IPC-A-600H, så detta dokument är med andra ord utmärkt att ha till hands vid ankomstkontroll och avsyning, men är också ett värdefullt stöddokument för inköpare och konstruktörer.
Pris: 800 kr (bok), 840 kr (CD), 1200 kr (bok + CD).
IPC-6012B ”Kvalifikations- och utförandespecifikation för rigida mönsterkort” är en beskrivning av hur mönsterkort skall tillverkas för att uppfylla kraven i A-600G. Den används som fördjupning och komplement tillsammans med IPC-A-600G och består av ytterligare detaljerad textinformation, figurer och tabeller, t ex tjocklek på pläterad koppar, nickel-guld, kemiskt silver osv. IPC-6012B har också en användbar tabell i bokstavsordning och består av många konkreta detaljer lämpliga även för konstruktörer.
Båda dessa dokument har successivt ersatt Perfag-specifikationerna, men många har uppfattat IPC:s mönsterkortspecifikationer som svårlästa och svårtolkade mest pga den avancerade tekniska engelskan. Översättningen till svenska kommer därför att bli uppskattad av köpare, leverantörer, konstruktörer, mottagningskontroll, avsyningspersonal och kvalitetsavdelningen inom elektronikindustrin då det minskar risken för feltolkning. Användandet av IPC-A-600 och IPC-6012 kommer att bli lika naturliga för mönsterkort som IPC-A-610 är för kretskort och lödning.
IPC-A-600H och IPC-6012B har översatts av Esbjörn Johansson i samarbete med Scanditron.
IPC-specifikationer för mönsterkort
IPC-6011
Generic Performance Specification for Printed Boards
This specification establishes the general requirements and responsibilities for suppliers and users of printed boards. Serving as the foundation for the IPC-6010 Board Performance Documents series, it describes quality and reliability assurance requirements that must be met. For use with IPC-6012 through IPC-6018. Supersedes IPC-RB-276, IPC-SC-320, IPC-TC-500, IPC-ML-950C. 15 pages. Released July 1996.
Pris: 416 kr (bok), 456 kr (CD).
IPC-6012C
Qualification and Performance Specification for Rigid Printed Boards
This specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. Revision C incorporates many new requirements in areas such as selection for procurement, new surface finishes, hole plating thickness, measling, weave exposure, copper cap plating of filled holes, laminate cracks and voids, etchback, blind and buried via fill, acceptance testing and frequency, and requirements for thermal stres testing. This revision synchronizes to the IPC-A-600H. For use with IPC-6011. Supersedes IPC-6012B with Amendment 1. 52 pages. Released April 2010.
Pris: 744 kr (bok), 784 kr (CD), 1152 kr (bok+CD).
IPC-6013B
Qualification and Performance Specification for Flexible Printed Boards
Covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, plated-through holes and blind/buried vias. Revision B incorporates updated requirements for surface plating, measles, foreign inclusions, adhesive squeeze out, solderable annular ring, PTH coppar wrap, plating folds, microsection evaluations and acceptance testing frequency and more. Supersedes IPC-6013A with Amendment 2. For use with IPC-6011. 40 pages.
Released January 2009.
Pris: 832 kr (bok), 872 kr (CD), 1192 kr (bok + CD).
Basmaterial
IPC-4101C
Specification for Base Materials for Rigid and Multilayer Printed Boards
This specification covers the requirements for base materials that are referred to as laminate or prepreg. These are to be used primarily for rigid and multilayer printed boards for electrical and electronic circuits. This document contains 66 individual specification sheets that can be searched using key words. These key words allow the document's user to find materials of a similar nature, but with specific differing properties that fine-tune their laminate and/or prepreg selection needs. This revision's 11 new specification sheets reflect the expanded offerings for current commercially available laminates and prepregs. These 11 new specification sheets add laminate and prepreg materials to this document that have improved or additional properties that include one or more of the following: low halogen content, lead-free applications, high thermal performance or high speed/high frequency performance. 137 pages. Released August 2009.
Pris: 800 kr (bok), 840 kr (CD), 1200 kr (bok + CD).
IPC-4203
Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
Establishes the requirements for adhesive coated dielectric film materials used in the cover sheets and flexible adhesive bonding films of fabricated flexible printed circuitry and flexible flat cable. Provides comprehensive data that will help users more easily determine both material capability and compatibility. IPC-4203 includes adhesive-coated flexible dielectric film material specification sheets which are identified by material type.Closely aligned with IPC-4202 and IPC-4204. Supersedes IPC-FC-232C with Amendment 1 included and, in turn, IPC-FC-232C, IPC-FC-232B, IPC-FC-232A, IPC-FC-232 and IPC-FC-233. 45 pages. Released May 2002.
Pris: 496 kr (bok), 536 kr (CD).
Kopparfolie
IPC-4562A
Metal Foil for Printed Board Applications
This specification covers metal foils supported by carrier films and unsupported foils suitable for subsequent use in only printed boards and addresses the requirements for procurement of these same metal foils. Unless otherwise agreed upon between user and supplier (AABUS), metal foils shall be considered acceptable as long as the requirements in this specification are met. 27 pages. Released April 2008.
Pris: 416 kr (bok), 456 kr (CD).
Ytbehandlingar
IPC-4552
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
In answer to numerous industry requests for guidance on Electroless Nickel/Immersion Gold (ENIG), the IPC-4552 has been developed. Containing full color photographs, this specification sets the requirements for the use of ENIG as a surface finish for printed circuit boards. It includes requirements for ENIG deposit thicknesses based on performance criteria. It will be an invaluable resource for use by suppliers, board fabricators, electronics manufacturing services (EMS) and original equipment manufacturers (OEMs). The specification's Appendix also includes a FREE copy of the highly sought after technical paper "Standard Developments Efforts of Electroless Nickel Immersion Gold" by George Milad and Gerard O'Brien.
The ENIG board surface finish is an electroless nickel layer capped with a thin layer of immersion gold. The immersion gold protects the underlying nickel from oxidation or passivation over its intended life. It is a multifunctional surface finish, applicable to soldering, aluminum wire bonding, press fit connections, and as a contact surface. 29 pages. Released October 2002.
Pris: 656 kr (bok), 736 kr (CD).
IPC-4553A
Specification for Immersion Silver Plating for Printed Circuit Boards
This specification sets requirements based on performance criteria for the use of Immersion Silver (IAg) as a surface finish for printed circuit boards. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) companies and original equipment manufacturers (OEM). IAg is a thin immersion deposit over copper. It is a multifunctional surface finish, applicable to soldering. It may also be applicable for some press fit connections and as a contact surface. It has the potential to be suitable for aluminum wire bonding. The immersion silver protects the underlying copper from oxidation over its intended shelf life. Exposure to moisture and air contaminants, such as sulfur and chlorine, may negatively impact the useful life of the deposit. The impact can range from a slight discoloration of the deposit to the pads turning completely black. Proper packaging is a requirement. Note that, in this revision, both a single thickness range is in place and an upper limit for immersion silver thickness has been established. 36 pages. Released May 2009.
Pris: 744 kr (bok), 784 kr (CD), 1152 kr (Bok + CD).
IPC-4554
Specification for Immersion Tin Plating for Printed Circuit Boards
IPC-4554 is the third document in a series of specifications [the first two are: IPC-4552 which addresses electroless nickel/immersion gold (ENIG) and IPC-4553 which addresses immersion silver (IAg)] that set the requirements for printed circuit board surface finishes that are alternates to eutectic tin-lead. IPC-4554, a full color document, is intended for use by supplier, manufacturer, contract manufacturer (CM) and original equipment manufacturer (OEM). The immersion tin (ISn) is a metallic finish deposited by a chemical displacement reaction that is applied directly over the basis metal of the PCB, that is, copper. ISn is primarily used as a solderable surface. It has been used in press fit connections and as the interface for Zero Insertion Force (ZIF) edge connectors. The ISn protects the underlying copper from oxidation over its intended shelf life.
57 pages. Released January 2007.
Pris: 744 kr (bok), 784 kr (CD), 1152 kr (Bok + CD).
Lödmask
NY!
IPC-SM-840E
Qualification and Performance Specification of Permanent Solder Mask
Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification, resistances to solvents, and electrical requirements. Revision E incorporates requirements for flexible cover materials used as a flexible dielectric protective layer over etched conductors and other conductive features.19 pages. Released December 2010.
Pris: 496 kr (bok), 536 kr (CD), 744 kr (bok + CD).